Researchers at Carnegie Mellon University’s School of Computer Science and the Israel Institute of Technology’s Technion have created a new generation of 3D sensors capable of capturing such micron-scale depth detail. Gkioulekas and Alankar Kotwal, a recent Ph.D. graduate in robotics, will present their work at the Computer Vision and Pattern Recognition Conference this month in Vancouver, Canada. Detailed imaging is critical for applications such as inspection and fabrication, where fast and accurate 3D sensing at these scales is crucial. It is also valuable in areas like virtual reality, autonomous systems, medical imaging and other computer vision applications that require accurate 3D representations. Read more about Passive Micron-Scale Time-of-Flight With Sunlight Interferometry and Swept Angle Synthetic Wavelength Interferometry on the Imaging@CMU website.